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agilent hfbr-5103/-5103t 1300 nm 2000 m HFBR-5103A/-5103at/-5103p/-5103pe fddi, 100 mbps atm, and fast ethernet transceivers in low cost 1x9 package style data sheet description the hfbr-5100 family of transceivers from agilent technologies provide the system designer with products to implement a range of fddi and atm (asynchronous transfer mode) designs at the 100 mbps/ 125 mbd rate. the transceivers are all supplied in the new industry standard 1x9 sip package style with either a duplex sc or a duplex st* connector interface. fddi pmd, atm and fast ethernet 2000 m backbone links the hfbr-5103/-5103t are 1300 nm products with optical performance compliant with the fddi pmd standard. the fddi pmd standard is iso/iec 9314-3: 1990 and ansi x3.166 - 1990. these transceivers for 2000 meter multimode fiber backbones are supplied in the small 1x9 duplex sc or st package style for those designers who want to avoid the larger mic/r (media interface connector/receptacle) defined in the fddi pmd standard. features ?full compliance with the optical performance requirements of the fddi pmd standard ?full compliance with the fddi lcf- pmd standard ?full compliance with the optical performance requirements of the atm 100 mbps physical layer ?full compliance with the optical performance requirements of 100 base-fx version of ieee 802.3u ?multisourced 1x9 package style with choice of duplex sc or duplex st* receptacle ?wave solder and aqueous wash process compatible ?manufactured in an iso 9002 certified facility applications multimode fiber backbone links multimode fiber wiring closet to desktop links multimode fiber media converter agilent technologies also provides several other fddi products compliant with the pmd and sm-pmd standards. these products are available with mic/ r, st and fc connector styles. they are available in the 1x13 and 2x11 transceiver and 16 pin transmitter/receiver package styles for those designs that require these alternate configurations. the hfbr-5103/-5103t is also useful for both atm 100 mbps interfaces and fast ethernet 100 base-fx interfaces. the atm forum user-network interface (uni) standard, version 3.0, defines the physical layer for 100 mbps multimode fiber interface for atm in section 2.3 to be the fddi pmd standard. likewise, the fast ethernet alliance defines the physical layer for 100 base- fx for fast ethernet to be the fddi pmd standard. note: the t in the product numbers indicates a transceiver with a duplex st connector receptacle. product numbers without a t indicate transceivers with a duplex sc connector receptacle. *st is a registered trademark of at&t lightguide cable connectors.
2 atm applications for physical layers other than 100 mbps multimode fiber interface are supported by agilent. products are available for both the single mode and the multimode fiber sonet-oc-3c (sts-3c) atm interface and the 155 mbps atm 94 mbd multimode fiber atm interface as specified in the atm forum uni. transmitter sections the transmitter sections of the hfbr-5103 series utilize 1300 nm surface emitting ingaasp leds. these leds are packaged in the optical subassembly portion of the transmitter section. they are driven by a custom silicon ic which converts differential pecl logic signals, ecl referenced (shifted) to a +5 volt supply, into an analog led drive current. receiver sections the receiver sections of the hfbr-5103 series utilize ingaas pin photodiodes coupled to a custom silicon transimpedance preamplifier ic. these are packaged in the optical subassembly portion of the receiver. these pin/preamplifier combinations are coupled to a custom quantizer ic which provides the final pulse shaping for the logic output and the signal detect function. the data output is differential. the signal detect output is single-ended. both data and signal detect outputs are pecl compatible, ecl referenced (shifted) to a +5 volt power supply. package the overall package concept for the agilent transceivers consists of the following basic elements; two optical subassemblies, an electrical subassembly and the housing as illustrated in figure 1 and figure 1a. figure 2b shows the outline drawing for options that include mezzanine height with extended shield. the package outline drawing and pin out are shown in figures 2, 2a and 3. the details of this package outline and pin out are compliant with the multisource definition of the 1x9 sip. the low profile of the agilent transceiver design complies with the maximum height allowed for the duplex sc connector over the entire length of the package. the optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. the electrical subassembly consists of a high volume multilayer printed circuit board on which the ic chips and various surface-mounted passive circuit elements are attached. the package includes internal shields for the electrical and optical subassemblies to ensure low emi emissions and high immunity to external emi fields. the outer housing including the duplex sc connector receptacle or the duplex st ports is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. the solder posts of the agilent design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. the transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. the two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with duplex or simplex sc or st connectored fiber cables. data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex sc receptacle optical subassemblies led preamp ic differential single-ended differential figure 1. sc block diagram
3 data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex st receptacle optical subassemblies led preamp ic differential single-ended differential figure 1a. st block diagram. figure 2. package outline drawing with standard height. 39.12 (1.540) max. area reserved for process plug 12.70 (0.500) 25.40 (1.000) max. 12.70 (0.500) 10.35 (0.407) max. + 0.25 - 0.05 + 0.010 - 0.002 3.30 ?0.38 (0.130 ?0.015) hfbr-5xxx date code (yyww) singapore 2.92 (0.115) 18.52 (0.729) 4.14 (0.163) 20.32 (0.800) [8x(2.54/.100)] 23.55 (0.927) 16.70 (0.657) 17.32 (0.682) 20.32 (0.800) 23.32 (0.918) 0.46 (0.018) note 1 (9x) note 1 0.87 (0.034) 23.24 (0.915) 15.88 (0.625) note 1: the solder posts and electrical pins are phosphor bronze with tin lead over nickel plating. dimensions are in millimeters (inches). 1.27 (0.050 + 0.08 - 0.05 + 0.003 - 0.002 0.75 (0.030 ) ) a 6.35 (0.250) 5.93 ?0.1 (0.233 ?0.004)
4 figure 2a. st package outline drawing with standard height. 25.4 (1.000) max. 24.8 (0.976) 42 (1.654) max. 5.99 (0.236) 12.7 (0.500) 12.0 (0.471) max. 0.5 (0.020) 3.3 0.38 (0.130) ( 0.015) + 0.08 - 0.05 + 0.003 - 0.002 + 0.25 - 0.05 + 0.010 - 0.002 20.32 0.38 ( 0.015) hfbr-5103t date code (yyww) singapore 3.2 (0.126) 2.6 (0.102) 22.86 (0.900) 20.32 (0.800) [(8x (2.54/0.100)] 17.4 (0.685) 21.4 (0.843) 20.32 (0.800) 3.6 (0.142) 1.3 (0.051) 23.38 (0.921) 18.62 (0.733) note 1: phosphor bronze is the base material for the posts & pins with tin lead over nickel plating. dimensions in millimeters (inches). ( ( ( ( 0.46 (0.018) note 1 1.27 0.050
5 figure 2b. package outline drawing ?mezzanine height with extended shield. 39.6 (1.56) max. area reserved for process plug 12.70 (0.50) 25.4 (1.00) max. 12.7 (0.50) 20.32 (0.800) 20.32 (0.800) dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 0.38 (0.130 0.015) ) 20.32 (0.80) 0.51 (0.02) slot depth slot width 4.7 (0.185) 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 0.15 (0.622 0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 2.0 0.1 (0.079 0.004) 29.6 (1.16) 8x 2.54 (0.100) 10.2 (0.40) 1.3 (0.05) max. 2.09 (0.08) uncompressed uncompressed 9.8 (0.386) max. a figure 3. pin out diagram. 1 = v ee 2 = rd 3 = rd 4 = sd 5 = v cc 6 = v cc 7 = td 8 = td 9 = v ee top view n/c n/c rx tx
6 1 db of aging over normal commercial equipment mission life periods. contact your agilent sales representative for additional details. figure 4 was generated with an agilent fiber optic link model containing the current industry conventions for fiber cable specifications and the fddi pmd and lcf-pmd optical parameters. these parameters are reflected in the guaranteed performance of the transceiver specifications in this data sheet. this same model has been used extensively in the ansi and ieee committees, including the ansi x3t9.5 committee, to establish the optical performance requirements for various fiber optic interface standards. the cable parameters used come from the iso/iec jtc1/sc 25/wg3 generic cabling for customer premises per dis 11801 document and the eia/tia- 568-a commercial building telecommunications cabling standard per sp-2840. transceiver signaling operating rate range and ber performance for purposes of definition, the symbol (baud) rate, also called signaling rate, is the reciprocal of the shortest symbol time. data rate (bits/sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/ bit). when used in fddi and atm 100 mbps applications the performance of the 1300 nm transceivers is guaranteed over the signaling rate of 10 mbd to 125 mbd to the full conditions listed in individual product specification tables. the transceivers may be used for other applications at signaling rates outside of the 10 mbd to 125 mbd range with some penalty in the link optical power budget primarily caused by a reduction of receiver sensitivity. figure 5 gives an indication of the typical performance of these 1300 nm products at different rates. figure 4. optical power budget at bol versus fiber optic cable length. application information the applications engineering group in the agilent optical communication division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. you can contact them through your agilent sales representative. the following information is provided to answer some of the most common questions about the use of these parts. transceiver optical power budget versus link length optical power budget (opb) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. figure 4 illustrates the predicted opb associated with the transceiver series specified in this data sheet at the beginning of life (bol). these curves represent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125 m and 50/125 m fiber cables only. the area under the curves represents the remaining opb at any link length, which is available for overcoming non-fiber cable related losses. agilent led technology has produced 1300 nm led devices with lower aging characteristics than normally associated with these technologies in the industry. the industry convention is 1.5 db aging for 1300 nm leds. the agilent technologies 1300 nm leds will experience less than optical power budget (db) 4.0 14 0 fiber optic cable length (km) 0.5 1.5 2.0 2.5 12 10 8 6 4 3.5 2 1.0 3.0 0.15 hfbr-5103, 62.5/125 m hfbr-5103, 50/125 m
7 transceiver relative optical power budget at constant ber (db) 0 200 3.0 0 signal rate (mbd) 25 75 100 125 2.5 2.0 1.5 1.0 175 0.5 50 150 conditions: 1. prbs 2 7 -1 2. data sampled at center of data symbol. 3. ber = 10 -6 4. t a = 25 c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. these transceivers can also be used for applications which require different bit error rate (ber) performance. figure 6 illustrates the typical trade-off between link ber and the receivers input optical power level. transceiver jitter performance the agilent 1300 nm transceivers are designed to operate per the system jitter allocations stated in tables e1 of annexes e of the fddi pmd and lcf-pmd standards. the agilent 1300 nm transmitters will tolerate the worst case input electrical jitter allowed in these tables without violating the worst case output jitter requirements of sections 8.1 active output interface of the fddi pmd and lcf-pmd standards. the agilent 1300 nm receivers will tolerate the worst case input optical jitter allowed in sections 8.2 active input interface of the fddi pmd and lcf-pmd standards without violating the worst case output electrical jitter allowed in the tables e1 of the annexes e. the jitter specifications stated in the following 1300 nm transceiver specification tables are derived from the values in tables e1 of annexes e. they represent the worst case jitter contribution that the transceivers are allowed to make to the overall system jitter without violating the annex e allocation example. in practice the typical contribution of the agilent transceivers is well below these maximum allowed amounts. figure 5. transceiver relative optical power budget at constant ber vs. signaling rate. figure 6. bit error rate vs. relative receiver input optical power. bit error rate -6 4 1 x 10 -2 relative input optical power db -4 2 -2 0 1 x 10 -4 1 x 10 -6 1 x 10 -8 2.5 x 10 -10 1 x 10 -11 hfbr-5103/5103t series conditions: 1. 125 mbd 2. prbs 2 7 -1 3. center of symbol sampling. 4. t a = 25 c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. center of symbol 1 x 10 -12 1 x 10 -7 1 x 10 -5 1 x 10 -3 recommended handling precautions agilent recommends that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (esd). the hfbr-5100 series of transceivers meet mil-std-883c method 3015.4 class 2 products. care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance.
8 solder and wash process compatibility the transceivers are delivered with protective process plugs inserted into the duplex sc or duplex st connector receptacle. this process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. these transceivers are compatible with either industry standard wave or hand solder processes. shipping container the transceiver is packaged in a shipping container designed to protect it from mechanical and esd damage during shipment or storage. board layout - decoupling circuit and ground planes it is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. figure 7 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. it is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. this recommendation is in keeping with good high frequency board layout practices. board layout - hole pattern the agilent transceiver complies with the circuit board ?ommon transceiver footprint?hole pattern defined in the original multisource announcement which defined the 1x9 package style. this drawing is reproduced in figure 8 with the addition of ansi y14.5m compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. board layout - mechanical for applications providing a choice of either a duplex sc or a duplex st connector interface, while utilizing the same pinout on the printed circuit board, the st port needs to protrude from the chassis panel a minimum of 9.53 mm for sufficient clearance to install the st connector. figure 7. recommended decoupling and termination circuits no internal connection no internal connection hfbr-510x top view v ee rd rd sd v cc v cc td td v ee 123456789 c1 c2 l1 l2 r2 r3 r1 r4 c5 c3 c4 r9 r10 v cc filter at v cc pins transceiver r5 r7 r6 r8 c6 rd rd sd v cc td td termination at phy device inputs notes: the split-load terminations for ecl signals need to be located at the input of devices receiving those ecl signals. recommend 4-layer printed circuit board with 50 ohm microstrip signal paths be used. termination at transceiver inputs r1 = r4 = r6 = r8 = r10 = 130 ohms. r2 = r3 = r5 = r7 = r9 = 82 ohms. c1 = c2 = c3 = c5 = c6 = 0.1 f. c4 = 10 f. l1 = l2 = 1 h coil or ferrite inductor. rx rx tx tx v cc v cc rx tx please refer to figure 8a for a mechanical layout detailing the recommended location of the duplex sc and duplex st transceiver packages in relation to the chassis panel. for both shielded design options, figure 8b identifies front panel aperture dimensions.
9 regulatory compliance these transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of information technology equipment. see the regulatory compliance table for details. additional information is available from your agilent sales representative. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the transceiver prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precautions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. to the extent that the duplex sc connector is exposed to the outside of the equipment chassis it may be subject to whatever esd system level test criteria that the equipment is intended to meet. electromagnetic interference (emi) most equipment designs utilizing these high speed transceivers from agilent will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. these products are suitable for use in designs ranging from a desktop computer with a single transceiver to a concentrator or switch product with a large number of transceivers. figure 8. recommended board layout hole pattern (8x) 2.54 .100 20.32 .800 20.32 .800 1.9 0.1 .075 .004 (2x) 0.000 ma 0.8 0.1 .032 .004 (9x) 0.000 ma a top view in all well-designed chassis, two 0.5" holes for st connectors to protrude through will provide 4.6 db more shielding than one 1.2" duplex sc rectangular cutout. thus, in a well-designed chassis, the duplex st 1x9 transceiver emissions will be identical to the duplex sc 1x9 transceiver emissions.
10 figure 8a. recommended common mechanical layout for sc and st 1x9 connectored transceivers. 25.4 42.0 24.8 9.53 (note 1) 39.12 6.79 25.4 12.09 11.1 0.75 12.0 0.51 note 1: minimum distance from front of connector to the panel face.
11 0.43 27.4 0.50 (1.08 0.02) 9.4 (0.374) 6.35 (0.25) module protrusion + 0.02 0.01 10.9 + 0.5 0.25 () 2x 0.8 (0.032) 2x 0.8 (0.032) a pcb bottom view dimensions are in millimeters (inches). all dimensions are 0.025 mm unless otherwise specified. figure 8b. dimensions shown for mounting module with extended shield to panel.
12 regulatory compliance table feature test method performance electrostatic discharge mil-std-883c meets class 2 (2000 to 3999 volts) (esd) to the electrical method 3015.4 withstand up to 2200 v applied between pins electrical pins. electrostatic discharge variation of typically withstand at least 25 kv without damage (esd) to the duplex sc iec 801-2 when the duplex sc connector receptacle is receptacle contacted by a human body model probe. electromagnetic fcc class b typically provide a 13 db margin (with duplex sc interference (emc) cenelec cen55022 package) or a 9 db margin (with duplex st class b (cispr 22b) package) to the noted standard limits when tested vcci class 2 at a certified test range with the transceiver mounted to a circuit card without a chassis enclosure. immunity variation of iec 801-3 typically show no measurable effect from a 10 v/m field swept from 10 to 450 mhz applied to the transceiver when mounted to a circuit card without a chassis enclosure. figure 9. transmitter output optical spectral width (fwhm) vs. transmitter output optical center wavelength and rise/fall times. 1380 200 100 c transmitter output optical center wavelength nm 1200 1300 1320 180 160 140 120 1360 1340 ? transmitter output optical spectral width (fwhm) nm t r/f transmitter output optical rise/fall times ns 1.5 2.0 3.0 3.5 2.5 3.0 3.5 hfbr-5103 fddi transmitter test results of c , ? and t r/f are correlated and comply with the allowed spectral width as a function of center wavelength for various rise and fall times.
13 transceiver reliability and performance qualification data the 1x9 transceivers have passed agilent reliability and performance qualification testing and are undergoing ongoing quality monitoring. details are available from your agilent sales representative. these transceivers are manufactured at the agilent singapore location which is an iso 9002 certified facility. immunity equipment utilizing these transceivers will be subject to radio-frequency electromagnetic fields in some environments. these transceivers have a high immunity to such fields. for additional information regarding emi, susceptibility, esd and conducted noise testing procedures and results on the 1x9 transceiver family, please refer to applications note 1075, testing and measuring electromagnetic compatibility performance of the hfbr-510x/-520x fiber optic transceivers. figure 10. output optical pulse envelope. 40 0.7 10.0 4.850 1.525 0.525 5.6 100% time interval 0.725 0.725 4.40 1.975 0.075 0.50 0.025 -0.025 0.0 -0.05 0.10 10.0 5.6 1.525 0.525 4.850 80 500 ppm 4.40 1.975 0.075 0.90 1.025 1.25 time ns 0% time interval 1.00 0.975 relative amplitude the hfbr-5103 output optical pulse shape shall fit within the boundaries of the pulse envelope for rise and fall time measurements.
14 applications support materials contact your local agilent component field sales office for information on how to obtain pcb layouts, test boards and demo boards for the 1x9 transceivers. evaluation kits agilent has available three evaluation kits for the 1x9 transceivers. the purpose of these kits is to provide the necessary materials to evaluate the performance of the hfbr-510x family in a pre-existing 1x13 or 2x11 pinout system design configuration or when connectored to various test equipment. 1. hfbr-0319 evaluation test fixture board this test fixture converts +5 v ecl 1x9 transceivers to 5 v ecl bnc coax connections so that direct connections to industry standard fiber optic test equipment can be accomplished. accessory duplex sc connectored cable assemblies agilent recommends for optimal coupling the use of flexible-body duplex sc connectored cable. accessory duplex st connectored cable assemblies agilent recommends the use of duplex push-pull connectored cable for the most repeatable optical power coupling performance. figure 11. relative input optical power vs. eye sampling time position. relative input optical power (db) -4 4 0 eye sampling time position (ns) -3 -1 0 1 5 4 3 2 3 1 -2 2 2.5 x 10 -10 ber 1.0 x 10 -12 ber conditions: 1.t a = 25 c 2. v cc = 5 vdc 3. input optical rise/fall times = 1.0/2.1 ns. 4. input optical power is normalized to center of data symbol. 5. note 20 and 21 apply. hfbr-5103 series
15 -31.0 dbm -45.0 dbm signal detect (on) signal detect (off) as max input optical power ( > 1.5 db step increase) input optical power ( > 4.0 db step decrease) p o = max (p s or -45.0 dbm) (p s = input power for ber < 10 2 ) min (p o + 4.0 db or -31.0 dbm) p a (p o + 1.5 db < p a < -31.0 dbm) optical power time signal detect output as max maximum acquisition time (signal). as max is the maximum signal detect assertion time for the station. as max shall not exceed 100.0 s (130 s for -40 c to 0 c). the default value of as max is 100.0 s. ans max maximum acquisition time (no signal). ans max is the maximum signal detect deassertion time for the station. ans max shall not exceed 350 s (130 s for -40 c to 0 c). the default value of as max is 350 s. ans max figure 12. signal detect thresholds and timing. hfbr-5103 series absolute maximum ratings parameter symbol min. typ. max. unit reference storage temperature t s -40 100 c lead soldering temperature t sold 260 c lead soldering time t sold 10 sec. supply voltage v cc -0.5 7.0 v data input voltage v i -0.5 v cc v differential input voltage v d 1.4 v note 1 output current i o 50 ma
16 hfbr-5103 series recommended operating conditions* parameter symbol min. typ. max. unit reference ambient operating temperature t a 070 c supply voltage v cc 4.75 5.25 v data input voltage - low v il - v cc -1.810 -1.475 v data input voltage - high v ih - v cc -1.165 -0.880 v data and signal detect output load r l 50 ? note 2 transmitter electrical characteristics* (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference supply current i cc 145 185 ma note 3 power dissipation p diss 0.76 0.97 w data input current - low i il -350 0 a data input current - high i ih 14 350 a receiver electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v)* parameter symbol min. typ. max. unit reference supply current i cc 82 145 ma note 4 power dissipation p diss 0.3 0.5 w note 5 data output voltage - low v ol - v cc -1.840 -1.620 v note 6 data output voltage - high v oh - v cc -1.045 -0.880 v note 6 data output rise time t r 0.35 2.2 ns note 7 data output fall time t f 0.35 2.2 ns note 7 signal detect output voltage - low v ol - v cc -1.840 -1.620 v note 6 signal detect output voltage - high v oh - v cc -1.045 -0.880 v note 6 signal detect output rise time t r 0.35 2.2 ns note 7 signal detect output fall time t f 0.35 2.2 ns note 7 *applies to hfbr-5103 &hfbr-5103t & hfbr-5103p/-5103pe series except for HFBR-5103A/-5103at. t a for HFBR-5103A/-5103at is -40 c and 85 c. *applies to hfbr-5103 &hfbr 5103t & hfbr-5103p/-5103pe series except for HFBR-5103A/-5103at. t a for HFBR-5103A/-5103at is -40 c and 85 c.. *applies to hfbr-5103 &hfbr 5103t & hfbr-5103p and 5103pe series except for HFBR-5103A/-5103at. t a for HFBR-5103A/-5103at is -40 c and 85 c.
17 hfbr-5103/-5103t transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference output optical power bol p o -19 -16.8 -14 dbm avg. note 11 62.5/125 m, na = 0.275 fiber eol -20 output optical power bol p o -22.5 -20.3 -14 dbm avg. note 11 50/125 m, na = 0.20 fiber eol -23.5 optical extinction ratio 0.001 0.03 % note 12 -50 -35 db output optical power at p o ( 0 ) -45 dbm avg. note 13 logic 0 state center wavelength l c 1270 1308 1380 nm note 14 figure 9 spectral width - fwhm ? l 137 170 nm note 14 figure 9 optical rise time t r 0.6 1.0 3.0 ns note 14, 15 figure 9, 10 optical fall time t f 0.6 2.1 3.0 ns note 14, 15 figure 9, 10 duty cycle distortion dcd 0.02 0.6 ns p-p note 16 contributed by the transmitter data dependent jitter ddj 0.02 0.6 ns p-p note 17 cobntributed by the transmitter
18 hfbr-5103/-5103t receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference input optical power p in min. (w) -33.5 -31 dbm avg. note 19 minimum at window edge figure 11 input optical power p in min. (c) -34.5 -31.8 dbm avg. note 20 minimum at eye center figure 11 input optical power maximum p in max. -14 -11.8 dbm avg. note 19 operating wavelength l 1270 1380 nm duty cycle distortion dcd 0.02 0.4 ns p-p note 8 contributed by the receiver data dependent jitter ddj 0.35 1.0 ns p-p note 9 contributed by the receiver random jitter contributed rj 1.0 2.14 ns p-p note 10 by the receiver signal detect - asserted p a p d + 1.5 db -33 dbm avg. note 21, 22 figure 12 signal detect - deasserted p d -45 dbm avg. note 23, 24 figure 12 signal detect - hysteresis p a - p d 1.5 2.4 db figure 12 signal detect assert time as_max 0 55 100 s note 21, (off to on) figure 12 signaldetectassert time as_max 0 55 130 s note 21, (off to on) for -40 c to 0 c figure 12 signal detect deassert time ans_max 0 110 350 s note 23, 24 (on to off) figure 12
19 10. random jitter contributed by the receiver is specified with an idle line state, 125 mbd (62.5 mhz square-wave), input signal. the input optical power level is at maximum p in min. (w) . see application information - trans- ceiver jitter section for further information. 11. these optical power values are measured with the following conditions: the beginning of life (bol) to the end of life (eol) optical power degradation is typically 1.5 db per the industry convention for long wavelength leds. the actual degradation observed in agilent s 1300 nm led products is < 1 db, as specified in this data sheet. over the specified operating voltage and temperature ranges. with halt line state, (12.5 mhz square-wave), input signal. at the end of one meter of noted optical fiber with cladding modes removed. the average power value can be converted to a peak power value by adding 3 db. higher output optical power transmitters are available on special request. 12. the extinction ratio is a measure of the modulation depth of the optical signal. the data 0 output optical power is compared to the data 1 peak output optical power and expressed as a percentage. with the transmitter driven by a halt line state (12.5 mhz square- wave) signal, the average optical power is measured. the data 1 peak power is then calculated by adding 3 db to the measured average optical power. the data 0 output optical power is found by measuring the optical power when the transmitter is driven by a logic 0 input. the extinction ratio is the ratio of the optical power at the 0 level compared to the optical power at the 1 level expressed as a percentage or in decibels. 13. the transmitter provides compli- ance with the need for transmit_disable commands from the fddi smt layer by providing an output optical power level of < -45 dbm average in response to a logic 0 input. this specification applies to either 62.5/125 m or 50/125 m fiber cables. 14. this parameter complies with the fddi pmd requirements for the tradeoffs between center wave- length, spectral width, and rise/fall times shown in figure 9. 15. this parameter complies with the optical pulse envelope from the fddi pmd shown in figure 10. the optical rise and fall times are measured from 10% to 90% when the transmitter is driven by the fddi halt line state (12.5 mhz square- wave) input signal. 16. duty cycle distortion contributed by the transmitter is measured at a 50% threshold using an idle line state, 125 mbd (62.5 mhz square- wave), input signal. see application information - transceiver jitter performance section of this data sheet for further details. 17. data dependent jitter contributed by the transmitter is specified with the fddi test pattern described in fddi pmd annex a.5. see applica- tion information - transceiver jitter performance section of this data sheet for further details. 18. random jitter contributed by the transmitter is specified with an idle line state, 125 mbd (62.5 mhz square-wave), input signal. see application information - trans- ceiver jitter performance section of this data sheet for further details. notes: 1. this is the maximum voltage that can be applied across the differen- tial transmitter data inputs to prevent damage to the input esd protection circuit. 2. the outputs are terminated with 50 ? connected to v cc -2 v. 3. the power supply current needed to operate the transmitter is provided to differential ecl circuitry. this circuitry maintains a nearly constant current flow from the power supply. constant current operation helps to prevent un- wanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. this value is measured with the outputs terminated into 50 ? connected to v cc - 2 v and an input optical power level of -14 dbm average. 5. the power dissipation value is the power dissipated in the receiver itself. power dissipation is calcu- lated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. these values are measured with respect to v cc with the output terminated into 50 ? connected to v cc - 2 v. 7. the output rise and fall times are measured between 20% and 80% levels with the output connected to v cc -2 v through 50 ? . 8. duty cycle distortion contributed by the receiver is measured at the 50% threshold using an idle line state, 125 mbd (62.5 mhz square- wave), input signal. the input optical power level is -20 dbm average. see application informa- tion - transceiver jitter section for further information. 9. data dependent jitter contributed by the receiver is specified with the fddi ddj test pattern described in the fddi pmd annex a.5. the input optical power level is -20 dbm average. see application informa- tion - transceiver jitter section for further information.
20 19. this specification is intended to indicate the performance of the receiver section of the transceiver when input optical power signal characteristics are present per the following definitions. the input optical power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a bit error ratio (ber) better than or equal to 2.5 x 10 -10 . at the beginning of life (bol) over the specified operating temperature and voltage ranges input symbol pattern is the fddi test pattern defined in fddi pmd annex a.5 with 4b/5b nrzi encoded data that contains a duty cycle base-line wander effect of 50 khz. this sequence causes a near worst case condition for inter- symbol interference. receiver data window time-width is 2.13 ns or greater and centered at mid-symbol. this worst case window time-width is the minimum allowed eye-opening presented to the fddi phy pm._data indication input (phy input) per the example in fddi pmd annex e. this minimum window time-width of 2.13 ns is based upon the worst case fddi pmd active input interface optical conditions for peak-to-peak dcd (1.0 ns), ddj (1.2 ns) and rj (0.76 ns) presented to the receiver. to test a receiver with the worst case fddi pmd active input jitter condition requires exacting control over dcd, ddj and rj jitter components that is difficult to implement with production test equipment. the receiver can be equivalently tested to the worst case fddi pmd input jitter condi- tions and meet the minimum output data window time-width of 2.13 ns. this is accomplished by using a nearly ideal input optical signal (no dcd, insignificant ddj and rj) and measuring for a wider window time- width of 4.6 ns. this is possible due to the cumulative effect of jitter components through their superpo- sition (dcd and ddj are directly additive and rj components are rms additive). specifically, when a nearly ideal input optical test signal is used and the maximum receiver peak-to- peak jitter contributions of dcd (0.4 ns), ddj (1.0 ns), and rj (2.14 ns) exist, the minimum window time- width becomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46 ns, or conserva- tively 4.6 ns. this wider window time-width of 4.6 ns guarantees the fddi pmd annex e minimum window time-width of 2.13 ns under worst case input jitter conditions to the agilent receiver. transmitter operating with an idle line state pattern, 125 mbd (62.5 mhz square-wave), input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 20. all conditions of note 19 apply except that the measurement is made at the center of the symbol with no window time-width. 21. this value is measured during the transition from low to high levels of input optical power. 22. the signal detect output shall be asserted within 100 s (130 s for 40 c to 0 c) after a step increase of the input optical power. the step will be from a low input optical power, 45 dbm, into the range between greater than p a , and 14 dbm. the ber of the receiver output will be 10 -2 or better during the time, ls_max (15 s) after signal detect has been asserted. see figure 12 for more information. 23. this value is measured during the transition from high to low levels of input optical power. the maximum value will occur when the input optical power is either -45 dbm average or when the input optical power yields a ber of 10 -2 or better, whichever power is higher. 24. signal detect output shall be de- asserted within 350 s after a step decrease in the input optical power from a level which is the lower of; -31 dbm or p d + 4 db (p d is the power level at which signal detect was deasserted), to a power level of -45 dbm or less. this step decrease will have occurred in less than 8 ns. the receiver output will have a ber of 10 -2 or better for a period of 12 s or until signal detect is deasserted. the input data stream is the quiet line state. also, signal detect will be deasserted within a maximum of 350 s after the ber of the receiver output degrades above 10 -2 for an input optical data stream that decays with a negative ramp function instead of a step function. see figure 12 for more information.
21 www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788 6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6271 2451 india, australia, new zealand: (+65) 6271 2394 japan: (+81 3) 3335-8152(domestic/ international), or 0120-61-1280(domestic only) korea: (+65) 6271 2194 malaysia, singapore: (+65) 6271 2054 taiwan: (+65) 6271 2654 data subject to change. copyright ? 2003 agilent technologies, inc. obsoletes 5988-5709en july 24, 2003 5988-9956en ordering information the following products . . . 1300nm led, 125 mbd, fddi, 100 mbps atm and fast eternet temperature range 0 c to +70 c hfbr-5103 duplex sc connector 1x9, standard height hfbr-5103t duplex st connector 1x9 hfbr-5103p duplex sc connector 1x9, mezzanine height hfbr-5103pe duplex sc connector 1x9, mezzanine height with extended shield 1300nm led, 125 mbd, fddi, 100 mbps atm and fast ethernet temperature range 40 c to +85 c HFBR-5103A duplex sc connector 1x9 HFBR-5103At duplex st connector 1x9

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